🔍 How do we keep next-gen electronics cool under pressure? BAE Systems is spearheading the second phase of a DARPA program, tackling the challenges of heat management in GaN (gallium nitride) electronics. This innovation is crucial for enhancing the performance and reliability of advanced technologies in various applications, from defense to telecommunications. As technology continues to advance, the need for effective thermal solutions becomes increasingly vital. It’s fascinating to see how engineering endeavors can pave the way for breakthroughs that impact our daily lives. What other challenges do you think the tech industry needs to solve next? Learn more about this exciting development here: https://interestingengineering.com/energy/bae-systems-darpa-gan-threads-phase-2 #Technology #Innovation #Electronics #DARPA #BAESystems